Jobid=618445408564550515 (0.028)
QuantWare in Delft is looking for a 3D Packaging & Tooling Engineer to lead the design and execution of high-precision assembly for their unique VIO™ quantum processor technology. This role demands at least 7 years of experience with semiconductor assembly and a strong grasp of 3D integration techniques. The position offers a competitive salary, a hybrid work arrangement, and various perks including relocation support, personal development budgets, and a robust pension plan.
#J-18808-Ljbffr
Deel deze vacature: