Qabird

Assistant/Associate Professor Advanced Packaging and Heterogeneous Integration (Delft, NL, 2628 CD) – Qabird – Delft

Jobid=627646753538450369 (0.0148)

ppAre you a leading researcher in advanced packaging and heterogeneous integration, ready to shape the future of semiconductor systems and build a world‑class research program at TU Delft? /p h3Job description /h3 pThe Section of Electronic Components, Technology and Materials (ECTM) at Delft University of Technology invites applications for an Associate Professor position in Advanced Packaging and Heterogeneous Integration. /p h3Responsibilities /h3 ul liDevelop an internationally visible and externally funded research program in advanced packaging and heterogeneous integration /li liProvide scientific leadership and contribute to the strategic direction of the ECTM section /li liAcquire substantial competitive funding (e.g., NWO, Horizon Europe, Chips JU, industry partnerships) /li liBuild and expand collaborations with leading semiconductor companies and research institutes (e.g., ASML, IMEC, European ecosystem) /li liContribute to education in microelectronics, including teaching and supervision of MSc and PhD students /li liStrengthen TU Delft’s position in Europe’s semiconductor and advanced packaging ecosystem /li /ul h3Specialisation areas /h3 ul liAdvanced electronic packaging and system integration /li liChiplet architectures and interconnect technologies /li li3D integration and hybrid bonding /li liWafer‑level and panel‑level packaging /li liPhotonic‑electronic co‑integration /li liThermal management and thermo‑mechanical reliability /li liMulti‑physics modeling and digital twins for electronics /li liPower electronics and wide‑bandgap packaging /li liRF / mmWave and high‑frequency packaging technologies /li /ul h3Essential qualifications /h3 ul liPhD in Electrical Engineering, Materials Science, Mechanical Engineering, Applied Physics, or a related field /li liStrong international research track record, demonstrated through high‑impact publications and/or patents /li liRecognized expertise in advanced packaging and/or heterogeneous integration /li liProven ability to acquire competitive research funding /li liExperience supervising PhD students and postdoctoral researchers /li liDemonstrated ability to collaborate with industry /li /ul h3Preferred qualifications /h3 ul liExperience in emerging domains such as chiplet‑based systems, AI hardware integration, co‑packaged optics, or reliability‑aware design /li liStrong track record in industry collaboration or technology transfer /li liVision for developing future directions in semiconductor system integration /li /ul h3Conditions of employment /h3 pThis position is offered as an Academic Career Track position (0.8 – 1.0 FTE). /p pAssistant Professor: During the Academic Career Track, you are expected to grow towards an Associate Professor position within a maximum of eight years. A temporary contract will be converted to a permanent contract no later than 12–18 months after a positive evaluation. /p pAssociate Professor: For an Associate Professor position, an initial temporary position of up to 1 year is offered, followed by a permanent contract upon positive assessment. /p pSalary scales: 11–12 €4,728 to €7,297 per month gross; 13–14 €6,512 to €8,673 per month gross. /p pSalary and benefits are in accordance with the Collective Labour Agreement for Dutch Universities. The employer offers a customizable compensation package, health insurance discounts, and a monthly work‑costs contribution. Flexible work schedules and partial remote work are possible. /p h3Benefits /h3 ul liUniversity Teaching Qualification (UTQ) support within three years for candidates with less than five years of teaching experience /li liEnglish competency training; Dutch language course within three years for non‑Dutch speakers /li liOptimal working environment with possibilities for career development in education, research, societal impact, innovation, leadership, and organisation /li /ul /p #J-18808-Ljbffr

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